A complete product team under one roof.
Build complex physical and digital products without coordinating a chain of disconnected specialist vendors. One technical lead owns the decisions that cross discipline boundaries.

Disciplines that work together.
The right specialists around the problem — with no cracks between the physical and digital product.

Hardware & electronics
- System architecture
- Schematic and PCB design
- Sensor and power integration
- Prototype build and bring-up
- Compliance preparation

Firmware & embedded
- MCU and SoC firmware
- Real-time systems
- Drivers and protocols
- Power optimisation
- Secure OTA updates

Robotics & automation
- Mechanical-electrical integration
- Motion and control systems
- ROS and autonomy
- Industrial automation
- Prototype machinery

AI & computer vision
- Edge AI
- Vision inspection
- Prediction and optimisation
- Custom model development
- Production ML pipelines

Software & cloud
- Device and companion apps
- IoT dashboards
- Cloud infrastructure
- Data platforms and APIs
- Enterprise integrations

Prototyping & manufacturing
- Rapid prototyping and assembly
- 3D printing
- Engineering documentation
- Production samples and testing
- Low-volume manufacturing
We join at the point of highest risk.
New product development
Turn an ambitious concept into a validated, manufacturable system.
Technical rescue
Diagnose stalled programs, redesign weak architecture and establish a credible recovery plan.
Innovation pilots
Test emerging technology against a real business case before committing to scale.
Product modernisation
Improve performance, connectivity, security or cost in an existing product.
Schematic to production.
Hardware depth handled by one team, with no handoff gaps between electronics, firmware and mechanical.
PCB design & layout
Multi-layer rigid and flex PCBs, high-speed design, RF and antenna optimisation, thermal management.
Embedded systems
Firmware for ARM Cortex, ESP32, STM32 and FPGA-based systems with RTOS integration.
Enclosure & mechanical
3D-printed prototypes, injection-moulding prep, IP-rated designs and thermal simulation.
Test jig development
Custom test fixtures, automated test systems and production-line integration.
DFM optimisation
Design-for-manufacture review, BOM optimisation and component sourcing strategy.
Lab & validation
In-house lab for bring-up, debug, EMC pre-compliance and environmental checks.
In-house lab
- 4-channel oscilloscope200 MHz, 2 GSa/s
- Hot-air rework stationSMD / BGA capable
- 3D printer farmFDM & resin
- Pick & place machine0402+ components
- Reflow ovenLead-free capable
- Logic analyser16-channel
- Spectrum analyser9 kHz – 3 GHz
- EMC pre-compliance benchRadiated & conducted
Planning a program? Read the product engineering guide

Bring us the hard part.
Share the product, challenge or technical risk you are facing. We’ll come back with a clear technical next step — no sales pitch disguised as discovery.